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Cu to Cu direct bonding with optimized self-annealing behav..:

, In: 2022 IEEE International Interconnect Technology Conference (IITC),
Han, Hanuel ; Lee, Chaerin ; Park, Sangwoo.. - p. 111-113 , 2022
Link: https://doi.org/10.1109/IITC52079.2022.9881281