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1 Ergebnisse
1
Cu to Cu direct bonding with optimized self-annealing behav..:
, In:
2022 IEEE International Interconnect Technology Conference (IITC)
,
Han, Hanuel
;
Lee, Chaerin
;
Park, Sangwoo
.. - p. 111-113 , 2022
Link:
https://doi.org/10.1109/IITC52079.2022.9881281
RT T1
2022 IEEE International Interconnect Technology Conference (IITC)
: T1
Cu to Cu direct bonding with optimized self-annealing behavior of the electroplated copper
UL https://suche.suub.uni-bremen.de/peid=ieee-9881281&Exemplar=1&LAN=DE A1 Han, Hanuel A1 Lee, Chaerin A1 Park, Sangwoo A1 Kim, Youjung A1 Yoo, Bongyoung YR 2022 SN 2380-6338 K1 Temperature K1 Films K1 Force K1 Behavioral sciences K1 Copper K1 Bonding K1 Cu-Cu direct bonding K1 self-annealing K1 Cu electrodeposition SP 111 OP 113 LK http://dx.doi.org/https://doi.org/10.1109/IITC52079.2022.9881281 DO https://doi.org/10.1109/IITC52079.2022.9881281 SF ELIB - SuUB Bremen
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