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Low Resistance Cu Vias for 24nm Pitch and Beyond:

, In: 2022 IEEE International Interconnect Technology Conference (IITC),
van der Veen, Marleen H. ; Pedreira, O. Varela ; Jourdan, N.... - p. 129-131 , 2022
Link: https://doi.org/10.1109/IITC52079.2022.9881285