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1 Ergebnisse
1
Selective and Tunable Slurry for Advanced Packaging Epoxy M..:
, In:
2022 IEEE International Interconnect Technology Conference (IITC)
,
Arata, Shogo
;
Noda, Chiaki
;
Ichige, Yasuhiro
... - p. 87-89 , 2022
Link:
https://doi.org/10.1109/IITC52079.2022.9881294
RT T1 <cTitle>2022 IEEE International Interconnect Technology Conference (IITC)</cTitle>: T1 <Title>Selective and Tunable Slurry for Advanced Packaging Epoxy Mold Compound</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9881294&Exemplar=1&LAN=DE A1 Arata, Shogo A1 Noda, Chiaki A1 Ichige, Yasuhiro A1 Nomura, Satoyuki A1 Widodo, T. S. A1 Tsunoda, N. A1 Brun, X. F. YR 2022 SN 2380-6338 K1 Silicon compounds K1 Packaging K1 Semiconductor device manufacture K1 Polymer films K1 Electromagnetic compatibility K1 Surface roughness K1 Rough surfaces K1 CMP K1 epoxy molding compound K1 Cu K1 3D integration & packaging SP 87 OP 89 LK http://dx.doi.org/https://doi.org/10.1109/IITC52079.2022.9881294 DO https://doi.org/10.1109/IITC52079.2022.9881294 SF ELIB - SuUB Bremen
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