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Barrierless ALD Molybdenum for Buried Power Rail and Via-to..:

, In: 2022 IEEE International Interconnect Technology Conference (IITC),

Gupta, Anshul ; Maes, Jan Willem ; Jourdan, Nicolas... - p. 58-60 , 2022

Link: https://doi.org/10.1109/IITC52079.2022.9881304

RT 
T1 <cTitle>2022 IEEE International Interconnect Technology Conference (IITC)</cTitle>: T1 <Title>Barrierless ALD Molybdenum for Buried Power Rail and Via-to-Buried Power Rail metallization</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-9881304&Exemplar=1&LAN=DE
				
A1 Gupta, Anshul
A1 Maes, Jan Willem
A1 Jourdan, Nicolas
A1 Zhu, Chiyu
A1 Datta, Sukanya
A1 Pedreira, Olalla Varela
A1 Le, Quoc Toan
A1 Radisic, Dunja
A1 Heylen, Nancy
A1 Pacco, Antoine
A1 Wang, Shouhua
A1 Mousa, Moataz
A1 Byun, Young
A1 Seidel, Felix
A1 de Wachter, Bart
A1 Murdoch, Gayle
A1 Tokei, Zsolt
A1 Litta, Eugenio Dentoni
A1 Horiguchi, Naoto
YR 2022
SN 2380-6338
K1 Rails
K1 Electromigration
K1 Annealing
K1 Metallization
K1 Surface resistance
K1 CMOS technology
K1 Business process re-engineering
K1 CMOS area scaling
K1 ALD Mo
K1 MOL
K1 molybdenum
K1 buried power rail
K1 BPR
K1 scaling booster
K1 A14
K1 A10
SP 58
OP 60
LK http://dx.doi.org/https://doi.org/10.1109/IITC52079.2022.9881304
DO https://doi.org/10.1109/IITC52079.2022.9881304
SF ELIB - SuUB Bremen

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