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Reliability benchmark of various via prefill metals:

, In: 2022 IEEE International Interconnect Technology Conference (IITC),
Pedreira, O. Varela ; Simons, V. ; van der Veen, M.H... - p. 31-33 , 2022
Link: https://doi.org/10.1109/IITC52079.2022.9881318