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1 Ergebnisse
1
Modeling of Hot-Via Technology for System-in-Package at Mil..:
, In:
2022 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT)
,
Tsao, Yi-Fan
;
Wang, Yuan
;
Chevtchenko, Serguei
... - p. 88-89 , 2022
Link:
https://doi.org/10.1109/RFIT54256.2022.9882348
RT T1 <cTitle>2022 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT)</cTitle>: T1 <Title>Modeling of Hot-Via Technology for System-in-Package at Millimeter-wave Frequencies</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9882348&Exemplar=1&LAN=DE A1 Tsao, Yi-Fan A1 Wang, Yuan A1 Chevtchenko, Serguei A1 Wolf, Mihaela A1 Wurfl, Joachim A1 Hsu, Heng-Tung YR 2022 K1 Waveguide transitions K1 Radio frequency K1 Millimeter wave circuits K1 System-in-package K1 Millimeter wave measurements K1 Integrated circuit interconnections K1 System integration K1 hot-via K1 interconnect K1 microstrip K1 grounded coplanar waveguide SP 88 OP 89 LK http://dx.doi.org/https://doi.org/10.1109/RFIT54256.2022.9882348 DO https://doi.org/10.1109/RFIT54256.2022.9882348 SF ELIB - SuUB Bremen
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