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1 Ergebnisse
1
Research on Transient Conduction Sensitivity of the Chips U..:
, In:
2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)
,
Fu, Lu
;
Yan, Zhaowen
;
Liu, Yuzhu
. - p. 503-505 , 2022
Link:
https://doi.org/10.1109/APEMC53576.2022.9888305
RT T1 <cTitle>2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)</cTitle>: T1 <Title>Research on Transient Conduction Sensitivity of the Chips Using TLP Method</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9888305&Exemplar=1&LAN=DE A1 Fu, Lu A1 Yan, Zhaowen A1 Liu, Yuzhu A1 Su, Donglin YR 2022 SN 2640-7469 K1 Integrated circuits K1 Sensitivity K1 Interference K1 Electrostatic discharges K1 Electromagnetic compatibility K1 Leakage currents K1 Transient analysis K1 integrated circuits (ICs) K1 transmission line pulse(TLP) K1 electrostatic distrarge(ESD) K1 transient conduction sensitivity SP 503 OP 505 LK http://dx.doi.org/https://doi.org/10.1109/APEMC53576.2022.9888305 DO https://doi.org/10.1109/APEMC53576.2022.9888305 SF ELIB - SuUB Bremen
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