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1 Ergebnisse
1
Absorptive-Material-Based Structure for Suppressing Unwante..:
, In:
2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)
,
Xing, Jiaqi
;
Liang, Xinglei
;
Fan, Yudi
... - p. 581-583 , 2022
Link:
https://doi.org/10.1109/APEMC53576.2022.9888463
RT T1 <cTitle>2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)</cTitle>: T1 <Title>Absorptive-Material-Based Structure for Suppressing Unwanted Radiation in Chip-Packages</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9888463&Exemplar=1&LAN=DE A1 Xing, Jiaqi A1 Liang, Xinglei A1 Fan, Yudi A1 Zhang, Ling A1 Li, Da A1 Li, Er-Ping YR 2022 SN 2640-7469 K1 Semiconductor device measurement K1 Impedance matching K1 Electromagnetic radiation K1 Electromagnetic compatibility K1 Dielectric measurement K1 Frequency measurement K1 Dielectrics K1 absorber K1 double-layer K1 chip-packages K1 EMC problem K1 high frequency SP 581 OP 583 LK http://dx.doi.org/https://doi.org/10.1109/APEMC53576.2022.9888463 DO https://doi.org/10.1109/APEMC53576.2022.9888463 SF ELIB - SuUB Bremen
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