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1 Ergebnisse
1
PEEC-Based On-chip PDN Impedance Modeling Using Layered Gre..:
, In:
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)
,
Li, Chaofeng
;
Zhao, Biyao
;
Pu, Bo
... - p. 164-168 , 2022
Link:
https://doi.org/10.1109/EMCSI39492.2022.9889515
RT T1 <cTitle>2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)</cTitle>: T1 <Title>PEEC-Based On-chip PDN Impedance Modeling Using Layered Green's Function</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9889515&Exemplar=1&LAN=DE A1 Li, Chaofeng A1 Zhao, Biyao A1 Pu, Bo A1 Wang, Xu A1 Kim, DongHyun A1 Fan, Jun YR 2022 K1 Solid modeling K1 Computational modeling K1 Silicon K1 System-on-chip K1 Impedance K1 Green's function methods K1 Integrated circuit modeling K1 impedance modeling K1 PDN K1 PEEC K1 LGF K1 SSNs K1 silicon substrate SP 164 OP 168 LK http://dx.doi.org/https://doi.org/10.1109/EMCSI39492.2022.9889515 DO https://doi.org/10.1109/EMCSI39492.2022.9889515 SF ELIB - SuUB Bremen
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