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1 Ergebnisse
1
A Novel Packaging with Direct Dielectric Liquid Cooling for..:
, In:
2022 IEEE International Workshop on Integrated Power Packaging (IWIPP)
,
Obaid Al-Hinaai, Amin Salim
;
Huesgen, Till
;
Buttay, Cyril
... - p. 1-6 , 2022
Link:
https://doi.org/10.1109/IWIPP50752.2022.9894055
RT T1 <cTitle>2022 IEEE International Workshop on Integrated Power Packaging (IWIPP)</cTitle>: T1 <Title>A Novel Packaging with Direct Dielectric Liquid Cooling for High Voltage Power Electronics</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9894055&Exemplar=1&LAN=DE A1 Obaid Al-Hinaai, Amin Salim A1 Huesgen, Till A1 Buttay, Cyril A1 Vagnon, Eric A1 Zeitler, Richard A1 Meyer, Daniela YR 2022 K1 Insulation K1 Computational fluid dynamics K1 High-voltage techniques K1 Packaging K1 Thermal conductivity K1 Electronic packaging thermal management K1 Power electronics K1 High voltage K1 Dielectric fluid K1 CFD K1 Cooling K1 power electronics SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/IWIPP50752.2022.9894055 DO https://doi.org/10.1109/IWIPP50752.2022.9894055 SF ELIB - SuUB Bremen
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