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Thermo-Mechanical Constraints for Packaging of Diamond Comp..:

, In: 2022 IEEE International Workshop on Integrated Power Packaging (IWIPP),
Fuste, Naum ; Sola, Emma ; Sanchez, David... - p. 1-7 , 2022
Link: https://doi.org/10.1109/IWIPP50752.2022.9894116