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1
Design of a test package for high voltage SiC diodes:
, In:
2022 IEEE International Workshop on Integrated Power Packaging (IWIPP)
,
Boutry, Arthur
;
Lefebvre, Bruno
;
Buttay, Cyril
... - p. 1-6 , 2022
Link:
https://doi.org/10.1109/IWIPP50752.2022.9894223
RT T1
2022 IEEE International Workshop on Integrated Power Packaging (IWIPP)
: T1
Design of a test package for high voltage SiC diodes
UL https://suche.suub.uni-bremen.de/peid=ieee-9894223&Exemplar=1&LAN=DE A1 Boutry, Arthur A1 Lefebvre, Bruno A1 Buttay, Cyril A1 Vagnon, Eric A1 Planson, Dominique A1 Phung, Luong Viet YR 2022 K1 Silver K1 Silicon carbide K1 Sintering K1 High-voltage techniques K1 Pressing K1 Packaging K1 Silicon K1 packaging K1 silicon carbide K1 diode K1 silver sintering SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/IWIPP50752.2022.9894223 DO https://doi.org/10.1109/IWIPP50752.2022.9894223 SF ELIB - SuUB Bremen
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