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1 Ergebnisse
1
DFI Filler Cells – New Embedded Type of Test Structures for..:
, In:
2022 IEEE 34th International Conference on Microelectronic Test Structures (ICMTS)
,
Lam, Stephen
;
Hess, Christopher
;
Weiland, Larg
... - p. 1-6 , 2022
Link:
https://doi.org/10.1109/ICMTS50340.2022.9898254
RT T1 <cTitle>2022 IEEE 34th International Conference on Microelectronic Test Structures (ICMTS)</cTitle>: T1 <Title>DFI Filler Cells – New Embedded Type of Test Structures for Non-Contact Detection of Electrical Defects on Product Wafers</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9898254&Exemplar=1&LAN=DE A1 Lam, Stephen A1 Hess, Christopher A1 Weiland, Larg A1 Moe, Matthew A1 Shen, Xumin William A1 Chen, John A1 De, Indranil A1 Strojwas, Marcin A1 Brozek, Tomasz YR 2022 SN 2158-1029 K1 Process monitoring K1 Inspection K1 Logic design K1 Microelectronics K1 Standards K1 Test Structure K1 E-beam K1 Defect K1 Characterization K1 Standard Cells K1 Yield SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICMTS50340.2022.9898254 DO https://doi.org/10.1109/ICMTS50340.2022.9898254 SF ELIB - SuUB Bremen
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