I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
Thermal-Aware Optimization of SoC Floorplan with Heterogeno..:
, In:
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
,
Yoo, Jongkyu
;
An, Taekeun
;
Oh, Chigwan
... - p. 1-6 , 2022
Link:
https://doi.org/10.1109/iTherm54085.2022.9899498
RT T1
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
: T1
Thermal-Aware Optimization of SoC Floorplan with Heterogenous Multi-Cores
UL https://suche.suub.uni-bremen.de/peid=ieee-9899498&Exemplar=1&LAN=DE A1 Yoo, Jongkyu A1 An, Taekeun A1 Oh, Chigwan A1 Cho, Youngsang A1 Lee, Heeseok A1 Im, Yunhyeok A1 Kim, Minkyu A1 Kim, Minsu YR 2022 SN 2694-2135 K1 Couplings K1 Costs K1 Thermal resistance K1 Thermomechanical processes K1 Optimization methods K1 Electronic packaging thermal management K1 Threshold voltage K1 System on Chip (SoC) K1 Cooling Zone (CZ) K1 Keep Out Zone (KOZ) K1 Central Processing Unit (CPU) K1 Package on Package (POP) K1 Regular Voltage Threshold (RVT) K1 Low Voltage Threshold (LVT) K1 Thermal Interface Material (TIM) K1 Epoxy Modeling Compound (EMC) SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/iTherm54085.2022.9899498 DO https://doi.org/10.1109/iTherm54085.2022.9899498 SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)