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1 Ergebnisse
1
Full-field pump-probe thermoreflectance imaging for charact..:
, In:
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
,
Alajlouni, Sami
;
Maize, Kerry
;
Shakouri, Ali
- p. 1-10 , 2022
Link:
https://doi.org/10.1109/iTherm54085.2022.9899513
RT T1
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
: T1
Full-field pump-probe thermoreflectance imaging for characterization of thin films and 3D integrated circuits
UL https://suche.suub.uni-bremen.de/peid=ieee-9899513&Exemplar=1&LAN=DE A1 Alajlouni, Sami A1 Maize, Kerry A1 Shakouri, Ali YR 2022 SN 2694-2135 K1 Integrated optics K1 Three-dimensional displays K1 Surface waves K1 Thermoreflectance K1 Thermal conductivity K1 Optical pumping K1 Optical sensors K1 Optical K1 non-contact K1 characterization K1 3D chips K1 thin film thermal conductivity K1 internal chip defects SP 1 OP 10 LK http://dx.doi.org/https://doi.org/10.1109/iTherm54085.2022.9899513 DO https://doi.org/10.1109/iTherm54085.2022.9899513 SF ELIB - SuUB Bremen
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