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1 Ergebnisse
1
Modeling Effect of Underfill Property Evolution on the FCBG..:
, In:
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
,
Lall, Pradeep
;
Kasturi, Madhu
;
Wu, Haotian
.. - p. 1-13 , 2022
Link:
https://doi.org/10.1109/iTherm54085.2022.9899528
RT T1 <cTitle>2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)</cTitle>: T1 <Title>Modeling Effect of Underfill Property Evolution on the FCBGA Reliability at Sustained Automotive Underhood Temperatures</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9899528&Exemplar=1&LAN=DE A1 Lall, Pradeep A1 Kasturi, Madhu A1 Wu, Haotian A1 Suhling, Jeff A1 Davis, Edward YR 2022 SN 2694-2135 K1 Time-frequency analysis K1 Thermal expansion K1 Temperature distribution K1 Thermomechanical processes K1 Aging K1 Electronic packaging thermal management K1 Mathematical models K1 Underfills K1 FCBGA package Model K1 Ansys K1 DMA K1 Dynamic mechanical properties K1 Glass transition temperature K1 Isothermal Aging K1 WLF equation K1 TTS superposition K1 Prony fitting SP 1 OP 13 LK http://dx.doi.org/https://doi.org/10.1109/iTherm54085.2022.9899528 DO https://doi.org/10.1109/iTherm54085.2022.9899528 SF ELIB - SuUB Bremen
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