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1 Ergebnisse
1
Numerical Analysis of Passive Manifold Microchannel Heat Ex..:
, In:
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
,
Jovin, Daniel
;
Jie, Jun
;
Hui, Harrison
. - p. 1-10 , 2022
Link:
https://doi.org/10.1109/iTherm54085.2022.9899550
RT T1 <cTitle>2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)</cTitle>: T1 <Title>Numerical Analysis of Passive Manifold Microchannel Heat Exchanger Enhancements</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9899550&Exemplar=1&LAN=DE A1 Jovin, Daniel A1 Jie, Jun A1 Hui, Harrison A1 Ooi, Kim Tiow YR 2022 SN 2694-2135 K1 Geometry K1 Manifolds K1 Performance evaluation K1 Numerical analysis K1 Thermomechanical processes K1 Numerical models K1 Heat sinks K1 Manifold Microchannel Heat Exchanger K1 Microchannel K1 Electronics Cooling K1 Liquid Cooling K1 Conjugate Heat Transfer K1 Heat Sink SP 1 OP 10 LK http://dx.doi.org/https://doi.org/10.1109/iTherm54085.2022.9899550 DO https://doi.org/10.1109/iTherm54085.2022.9899550 SF ELIB - SuUB Bremen
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