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1 Ergebnisse
1
Thermal Model Simplification of Mobile Device with Adaptive..:
, In:
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
,
Im, Yunhyeok
;
Jo, Hyungyung
;
Oh, Chigwan
... - p. 1-6 , 2022
Link:
https://doi.org/10.1109/iTherm54085.2022.9899553
RT T1
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
: T1
Thermal Model Simplification of Mobile Device with Adaptive Metamodel of Optimal Prognosis (AMOP)
UL https://suche.suub.uni-bremen.de/peid=ieee-9899553&Exemplar=1&LAN=DE A1 Im, Yunhyeok A1 Jo, Hyungyung A1 Oh, Chigwan A1 Cho, Young-Sang A1 Yoo, Jongkyu A1 Lee, Heeseok A1 Lee, Myunghoon A1 Yaddanapudi, Vamsi Krishna YR 2022 SN 2694-2135 K1 Adaptation models K1 Computational modeling K1 Computational fluid dynamics K1 Thermomechanical processes K1 Electronic packaging thermal management K1 Mobile handsets K1 System-on-chip K1 Equivalent Thermal Model K1 Transient Simulation K1 Smart Phone K1 Application Processor K1 AP K1 3D IC K1 Package on Package K1 POP K1 Adaptive Metamodel of Optimal Prognosis K1 AMOP K1 Evolution Algorithm K1 EA SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/iTherm54085.2022.9899553 DO https://doi.org/10.1109/iTherm54085.2022.9899553 SF ELIB - SuUB Bremen
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