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Thermal Model Simplification of Mobile Device with Adaptive..:

, In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),

Im, Yunhyeok ; Jo, Hyungyung ; Oh, Chigwan... - p. 1-6 , 2022

Link: https://doi.org/10.1109/iTherm54085.2022.9899553

RT 
T1 <cTitle>2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)</cTitle>: T1 <Title>Thermal Model Simplification of Mobile Device with Adaptive Metamodel of Optimal Prognosis (AMOP)</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-9899553&Exemplar=1&LAN=DE
				
A1 Im, Yunhyeok
A1 Jo, Hyungyung
A1 Oh, Chigwan
A1 Cho, Young-Sang
A1 Yoo, Jongkyu
A1 Lee, Heeseok
A1 Lee, Myunghoon
A1 Yaddanapudi, Vamsi Krishna
YR 2022
SN 2694-2135
K1 Adaptation models
K1 Computational modeling
K1 Computational fluid dynamics
K1 Thermomechanical processes
K1 Electronic packaging thermal management
K1 Mobile handsets
K1 System-on-chip
K1 Equivalent Thermal Model
K1 Transient Simulation
K1 Smart Phone
K1 Application Processor
K1 AP
K1 3D IC
K1 Package on Package
K1 POP
K1 Adaptive Metamodel of Optimal Prognosis
K1 AMOP
K1 Evolution Algorithm
K1 EA
SP 1
OP 6
LK http://dx.doi.org/https://doi.org/10.1109/iTherm54085.2022.9899553
DO https://doi.org/10.1109/iTherm54085.2022.9899553
SF ELIB - SuUB Bremen

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