I agree that this site is using cookies. You can find further informations here.
X
Merkliste 
 1 Ergebnisse 
 
1

Reworkable & rehealable packaging materials from the introd..:

, In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
Magbitang, Teddie ; Moore, Lucas ; Yu, Roy... - p. 1-6 , 2022
Link: https://doi.org/10.1109/iTherm54085.2022.9899557