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1 Ergebnisse
1
Thermal analysis of advanced back-end-of-line structures an..:
, In:
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
,
Chang, Xinyue
;
Oprins, Herman
;
Lofrano, Melina
... - p. 1-8 , 2022
Link:
https://doi.org/10.1109/iTherm54085.2022.9899564
RT T1 <cTitle>2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)</cTitle>: T1 <Title>Thermal analysis of advanced back-end-of-line structures and the impact of design parameters</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9899564&Exemplar=1&LAN=DE A1 Chang, Xinyue A1 Oprins, Herman A1 Lofrano, Melina A1 Vermeersch, Bjorn A1 Ciofi, Ivan A1 Pedreira, Olalla Varela A1 Tokei, Zsolt A1 De Wolf, Ingrid YR 2022 SN 2694-2135 K1 Sensitivity analysis K1 Thermal resistance K1 Layout K1 Metals K1 Conductivity K1 Benchmark testing K1 Thermal conductivity K1 back-end-of-line K1 material property K1 via density K1 barrier K1 FEM K1 thermal modeling SP 1 OP 8 LK http://dx.doi.org/https://doi.org/10.1109/iTherm54085.2022.9899564 DO https://doi.org/10.1109/iTherm54085.2022.9899564 SF ELIB - SuUB Bremen
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