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1 Ergebnisse
1
Equivalent thermal conductivity of a composite structure co..:
, In:
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
,
Hyun, Younghoon
;
Lee, Bruce Weon
;
Wook Jung, Ki
... - p. 1-8 , 2022
Link:
https://doi.org/10.1109/iTherm54085.2022.9899584
RT T1
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
: T1
Equivalent thermal conductivity of a composite structure considering heat spreading on neighboring layers
UL https://suche.suub.uni-bremen.de/peid=ieee-9899584&Exemplar=1&LAN=DE A1 Hyun, Younghoon A1 Lee, Bruce Weon A1 Wook Jung, Ki A1 Cho, Byeong Yeon A1 Im, Yunhyeok A1 Oh, Dan Kyung Suk YR 2022 SN 2694-2135 K1 Measurement errors K1 Thermal resistance K1 Simulation K1 Thermomechanical processes K1 Conductivity K1 Thermal conductivity K1 Particle measurements K1 Spreading resistanc K1 effective thermal conductivit K1 composite structur K1 semiconducto K1 bump K1 vi K1 HB SP 1 OP 8 LK http://dx.doi.org/https://doi.org/10.1109/iTherm54085.2022.9899584 DO https://doi.org/10.1109/iTherm54085.2022.9899584 SF ELIB - SuUB Bremen
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