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1 Ergebnisse
1
Thermal Modeling and Analysis of High Bandwidth Memory in 2..:
, In:
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
,
Kim, Taehwan
;
Lee, Jonggyu
;
Kim, Jaechoon
... - p. 1-5 , 2022
Link:
https://doi.org/10.1109/iTherm54085.2022.9899586
RT T1 <cTitle>2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)</cTitle>: T1 <Title>Thermal Modeling and Analysis of High Bandwidth Memory in 2.5D Si-interposer Systems</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9899586&Exemplar=1&LAN=DE A1 Kim, Taehwan A1 Lee, Jonggyu A1 Kim, Jaechoon A1 Lee, Eung-Chang A1 Hwang, Heejung A1 Kim, Youngdeuk A1 Oh, Dan Kyung Suk YR 2022 SN 2694-2135 K1 Solid modeling K1 Analytical models K1 Three-dimensional displays K1 Temperature K1 Thermal resistance K1 Thermomechanical processes K1 Bandwidth K1 High bandwidth memory (HBM) K1 thermal characteristics K1 thermal simulation model K1 2.5D Si-interposer System K1 stack thermal resistance K1 multi-chip package SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/iTherm54085.2022.9899586 DO https://doi.org/10.1109/iTherm54085.2022.9899586 SF ELIB - SuUB Bremen
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