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1 Ergebnisse
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Qualification of the Samtec SEAM and SEAF connectors for us..:
, In:
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
,
Dalal, Neil
;
Farvez, Nabid
;
Anderson, Kyle
... - p. 1-8 , 2022
Link:
https://doi.org/10.1109/iTherm54085.2022.9899599
RT T1
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
: T1
Qualification of the Samtec SEAM and SEAF connectors for use as a printed circuit board assembly (PCBA) stacking connector in space applications
UL https://suche.suub.uni-bremen.de/peid=ieee-9899599&Exemplar=1&LAN=DE A1 Dalal, Neil A1 Farvez, Nabid A1 Anderson, Kyle A1 Orr, Allison A1 Ling, Sharon A1 Hacala, Ryan YR 2022 SN 2694-2135 K1 Connectors K1 Vibrations K1 Space missions K1 Electric shock K1 Stacking K1 Thermomechanical processes K1 Thermal conductivity SP 1 OP 8 LK http://dx.doi.org/https://doi.org/10.1109/iTherm54085.2022.9899599 DO https://doi.org/10.1109/iTherm54085.2022.9899599 SF ELIB - SuUB Bremen
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