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An Advanced Fan-less AIoT Smart Edge Gateway with Thickness..:

, In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),

Yuan, Huayong ; Chen, Wei ; King, Michael... - p. 1-5 , 2022

Link: https://doi.org/10.1109/iTherm54085.2022.9899609

RT 
T1 <cTitle>2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)</cTitle>: T1 <Title>An Advanced Fan-less AIoT Smart Edge Gateway with Thickness Thermal Pad Design</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-9899609&Exemplar=1&LAN=DE
				
A1 Yuan, Huayong
A1 Chen, Wei
A1 King, Michael
A1 Wu, Aaron
A1 Chen, Barry
A1 Chiu, Clio
A1 Tseng, Karen
A1 Su, Lulu
A1 Chang, Richard
A1 Yang, Ryan
A1 Leu, Shoes
A1 Liang, Allen
A1 Zhang, Jun
A1 Chen, Haibin
A1 Liu, Liang
A1 Kuo, Danny
A1 Zhu, Kunye
A1 Ahuja, Nishi
A1 Qiao, Qing
A1 Li, Eric
YR 2022
SN 2694-2135
K1 Connectors
K1 Solid modeling
K1 Cooling
K1 System performance
K1 Graphics processing units
K1 Logic gates
K1 Reliability engineering
K1 Smart Edge Gateway
K1 AIOT
K1 Fan-less
K1 Thermal Pad
K1 Compact Size
K1 Extended Temperature
SP 1
OP 5
LK http://dx.doi.org/https://doi.org/10.1109/iTherm54085.2022.9899609
DO https://doi.org/10.1109/iTherm54085.2022.9899609
SF ELIB - SuUB Bremen

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