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1 Ergebnisse
1
Sharp Interface Simulation of IMC Growth and Void Evolution..:
, In:
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
,
Liao, Huanyu
;
Jois, Chetan
;
Prasad, Sudarshan
. - p. 1-7 , 2022
Link:
https://doi.org/10.1109/iTherm54085.2022.9899617
RT T1
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
: T1
Sharp Interface Simulation of IMC Growth and Void Evolution in Solder Microbumps
UL https://suche.suub.uni-bremen.de/peid=ieee-9899617&Exemplar=1&LAN=DE A1 Liao, Huanyu A1 Jois, Chetan A1 Prasad, Sudarshan A1 Subbarayan, Ganesh YR 2022 SN 2694-2135 K1 Thermodynamics K1 Solid modeling K1 Analytical models K1 Thermomechanical processes K1 Mathematical models K1 Behavioral sciences K1 Reliability K1 reaction-diffusion problem K1 sharp interface method K1 electromigration K1 IMC growth K1 solder void evolution SP 1 OP 7 LK http://dx.doi.org/https://doi.org/10.1109/iTherm54085.2022.9899617 DO https://doi.org/10.1109/iTherm54085.2022.9899617 SF ELIB - SuUB Bremen
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