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1 Ergebnisse
1
Parametric Study of The Geometry Design of Through-silicon ..:
, In:
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
,
Pan, Ke
;
Lai, Yangyang
;
Xu, Jiefeng
... - p. 1-8 , 2022
Link:
https://doi.org/10.1109/iTherm54085.2022.9899623
RT T1 <cTitle>2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)</cTitle>: T1 <Title>Parametric Study of The Geometry Design of Through-silicon Via in Silicon Interposer</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9899623&Exemplar=1&LAN=DE A1 Pan, Ke A1 Lai, Yangyang A1 Xu, Jiefeng A1 Yin, Pengcheng A1 Ha, Jonghwan A1 Cai, Chongyang A1 Yang, Junbo A1 Park, Seungbae YR 2022 SN 2694-2135 K1 Computational modeling K1 Thermomechanical processes K1 Artificial neural networks K1 Reliability engineering K1 Silicon K1 Numerical models K1 Copper K1 Through-silicon via (TSV) K1 thermomechanical reliability K1 in-plane displacement K1 TSV protrusion K1 ANN SP 1 OP 8 LK http://dx.doi.org/https://doi.org/10.1109/iTherm54085.2022.9899623 DO https://doi.org/10.1109/iTherm54085.2022.9899623 SF ELIB - SuUB Bremen
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