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1 Ergebnisse
1
Non-Destructive Evaluation of Thermal Interface Materials u..:
, In:
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
,
Kulkarni, Piyush
;
Zhang, Zechen
;
Rafsanjani, Fatemeh Hejripour
... - p. 1-6 , 2022
Link:
https://doi.org/10.1109/iTherm54085.2022.9899626
RT T1 <cTitle>2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)</cTitle>: T1 <Title>Non-Destructive Evaluation of Thermal Interface Materials using Modulated Heating of Selective Cores</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9899626&Exemplar=1&LAN=DE A1 Kulkarni, Piyush A1 Zhang, Zechen A1 Rafsanjani, Fatemeh Hejripour A1 Chang, Je-Young A1 Sammakia, Bahgat A1 Schiffres, Scott YR 2022 SN 2694-2135 K1 Temperature measurement K1 Heating systems K1 Temperature dependence K1 Semiconductor device measurement K1 Temperature K1 Current measurement K1 Electronic packaging thermal management K1 Thermal Interface Materials K1 Non-Destructive Testing K1 Frequency-Domain K1 Thermal Properties K1 In-situ Testing SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/iTherm54085.2022.9899626 DO https://doi.org/10.1109/iTherm54085.2022.9899626 SF ELIB - SuUB Bremen
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