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Development of a numerical simulation model for predicting ..:

, In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
Lee, J. ; Kim, S.J. ; Kim, B. - p. 1-4 , 2022
Link: https://doi.org/10.1109/iTherm54085.2022.9899659