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1 Ergebnisse
1
Multi-Scale Electroplated Porous Coating for Immersion Cool..:
, In:
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
,
Larimi, Yaser Nabavi
;
Ghaffari, Omidreza
;
Ganjali, Alireza
... - p. 1-7 , 2022
Link:
https://doi.org/10.1109/iTherm54085.2022.9899660
RT T1 <cTitle>2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)</cTitle>: T1 <Title>Multi-Scale Electroplated Porous Coating for Immersion Cooling of Electronics</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9899660&Exemplar=1&LAN=DE A1 Larimi, Yaser Nabavi A1 Ghaffari, Omidreza A1 Ganjali, Alireza A1 Al Sayed, Chady A1 Grenier, Francis A1 Jasmin, Simon A1 Frechette, Luc A1 Sylvestre, Julien YR 2022 SN 2694-2135 K1 Temperature measurement K1 Surface resistance K1 Thermal resistance K1 Immersion cooling K1 Coatings K1 Reliability K1 Copper K1 Pool boiling K1 porous coating K1 surface enhancement K1 immersion cooling K1 electronics cooling SP 1 OP 7 LK http://dx.doi.org/https://doi.org/10.1109/iTherm54085.2022.9899660 DO https://doi.org/10.1109/iTherm54085.2022.9899660 SF ELIB - SuUB Bremen
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