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CYTOP for bonding highly oriented pyrolytic graphite to be ..:
, In:
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
,
Vaca, Diego
;
Smet, Vanessa
;
Joshi, Yogendra
. - p. 1-6 , 2022
Link:
https://doi.org/10.1109/iTherm54085.2022.9899662
RT T1
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
: T1
CYTOP for bonding highly oriented pyrolytic graphite to be used as heat spreader in mobile devices
UL https://suche.suub.uni-bremen.de/peid=ieee-9899662&Exemplar=1&LAN=DE A1 Vaca, Diego A1 Smet, Vanessa A1 Joshi, Yogendra A1 Kumar, Satish YR 2022 SN 2694-2135 K1 Heating systems K1 Thermomechanical processes K1 Graphite K1 Conductivity K1 Thermal conductivity K1 Thermal management K1 Silicon K1 hot spots K1 highly oriented pyrolytic graphite K1 CYTOP SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/iTherm54085.2022.9899662 DO https://doi.org/10.1109/iTherm54085.2022.9899662 SF ELIB - SuUB Bremen
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