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1 Ergebnisse
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Characterization of Constitutive Equation of Sn-Bi by Study..:
, In:
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
,
Cai, Chongyang
;
Pan, Ke
;
Deo, Karthik
... - p. 1-6 , 2022
Link:
https://doi.org/10.1109/iTherm54085.2022.9899670
RT T1
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
: T1
Characterization of Constitutive Equation of Sn-Bi by Studying Creep Behavior of Flip Chip Solder Joints
UL https://suche.suub.uni-bremen.de/peid=ieee-9899670&Exemplar=1&LAN=DE A1 Cai, Chongyang A1 Pan, Ke A1 Deo, Karthik A1 Lai, Yangyang A1 Yang, Junbo A1 Wang, Jing A1 Park, Seungbae YR 2022 SN 2694-2135 K1 Thermal expansion K1 Temperature K1 Creep K1 Digital images K1 Thermomechanical processes K1 Materials reliability K1 Mathematical models K1 Sn-Bi solder K1 2D Digital Image Correlation K1 Constitutive equation SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/iTherm54085.2022.9899670 DO https://doi.org/10.1109/iTherm54085.2022.9899670 SF ELIB - SuUB Bremen
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