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1 Ergebnisse
1
Optimal thermo-mechanical reliability design of 2.5D lidles..:
, In:
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
,
Yang, Junbo
;
Cai, Chongyang
;
Yin, Pengcheng
... - p. 1-6 , 2022
Link:
https://doi.org/10.1109/iTherm54085.2022.9899678
RT T1
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
: T1
Optimal thermo-mechanical reliability design of 2.5D lidless package
UL https://suche.suub.uni-bremen.de/peid=ieee-9899678&Exemplar=1&LAN=DE A1 Yang, Junbo A1 Cai, Chongyang A1 Yin, Pengcheng A1 Pan, Ke A1 Lai, Yangyang A1 Wang, Jing A1 Park, Seungbae YR 2022 SN 2694-2135 K1 Solid modeling K1 Three-dimensional displays K1 Force K1 Fasteners K1 Fatigue K1 Electronic packaging thermal management K1 Silicon K1 2.5D package K1 FEA K1 lidless K1 solder fatigue life K1 thermal cycling SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/iTherm54085.2022.9899678 DO https://doi.org/10.1109/iTherm54085.2022.9899678 SF ELIB - SuUB Bremen
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