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1 Ergebnisse
1
Evaluation of Lifetime of Through-Hole Solder Joints Consid..:
, In:
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
,
Tsuyuki, Tomohiro
;
Yu, Qiang
;
Ohno, Yuki
... - p. 1-8 , 2022
Link:
https://doi.org/10.1109/iTherm54085.2022.9899688
RT T1 <cTitle>2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)</cTitle>: T1 <Title>Evaluation of Lifetime of Through-Hole Solder Joints Considering Mounting Process and Variation</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9899688&Exemplar=1&LAN=DE A1 Tsuyuki, Tomohiro A1 Yu, Qiang A1 Ohno, Yuki A1 Takikawa, Akihiro A1 Fukasu, Hisataka A1 Shio, Koji YR 2022 SN 2694-2135 K1 Heating systems K1 Shape K1 Wires K1 Process control K1 Lead K1 Plating K1 Fatigue K1 electronic devices K1 through-hole components K1 lead-free solder K1 Sn-Pb solder K1 variation K1 mounting temperature K1 fatigue life SP 1 OP 8 LK http://dx.doi.org/https://doi.org/10.1109/iTherm54085.2022.9899688 DO https://doi.org/10.1109/iTherm54085.2022.9899688 SF ELIB - SuUB Bremen
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