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1
Simulation analysis of temperature field and stress-strain ..:
, In:
2022 12th International Conference on CYBER Technology in Automation, Control, and Intelligent Systems (CYBER)
,
Xu, Lanying
;
Feng, Sichen
;
Ye, Guo-shan
. - p. 162-167 , 2022
Link:
https://doi.org/10.1109/CYBER55403.2022.9907626
RT T1 <cTitle>2022 12th International Conference on CYBER Technology in Automation, Control, and Intelligent Systems (CYBER)</cTitle>: T1 <Title>Simulation analysis of temperature field and stress-strain in form grinding of cycloidal gear</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9907626&Exemplar=1&LAN=DE A1 Xu, Lanying A1 Feng, Sichen A1 Ye, Guo-shan A1 Wu, Qiang YR 2022 SN 2642-6633 K1 Tensile stress K1 Gears K1 Software K1 Residual stresses K1 Land surface temperature K1 Finite element analysis K1 Transient analysis K1 cycloid gear K1 finite element analysis K1 temperature field K1 stress strain SP 162 OP 167 LK http://dx.doi.org/https://doi.org/10.1109/CYBER55403.2022.9907626 DO https://doi.org/10.1109/CYBER55403.2022.9907626 SF ELIB - SuUB Bremen
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