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1 Ergebnisse
1
Thermal Side-channel Leakage Protection in Monolithic Three..:
, In:
2022 IEEE 35th International System-on-Chip Conference (SOCC)
,
Dofe, Jaya
- p. 1-2 , 2022
Link:
https://doi.org/10.1109/SOCC56010.2022.9908080
RT T1
2022 IEEE 35th International System-on-Chip Conference (SOCC)
: T1
Thermal Side-channel Leakage Protection in Monolithic Three Dimensional Integrated Circuits
UL https://suche.suub.uni-bremen.de/peid=ieee-9908080&Exemplar=1&LAN=DE A1 Dofe, Jaya YR 2022 SN 2164-1706 K1 Heating systems K1 Three-dimensional displays K1 Power supplies K1 Side-channel attacks K1 Thermal noise K1 Thermal analysis K1 System-on-chip K1 3D IC K1 inductive coupling K1 physical unclonable function K1 side-channel attacks SP 1 OP 2 LK http://dx.doi.org/https://doi.org/10.1109/SOCC56010.2022.9908080 DO https://doi.org/10.1109/SOCC56010.2022.9908080 SF ELIB - SuUB Bremen
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