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1 Ergebnisse
1
Interconnection Reliability on FinFET Devices:
, In:
2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
,
Yang, Xin
;
Xue, Yongkang
;
Dong, Zuoyuan
... - p. 1-4 , 2022
Link:
https://doi.org/10.1109/IPFA55383.2022.9915773
RT T1
2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
: T1
Interconnection Reliability on FinFET Devices
UL https://suche.suub.uni-bremen.de/peid=ieee-9915773&Exemplar=1&LAN=DE A1 Yang, Xin A1 Xue, Yongkang A1 Dong, Zuoyuan A1 Wang, Chaolun A1 Ji, Zhigang A1 Tsai, Chihang A1 Wu, Yongren A1 Yu, Weisong A1 Wang, Runsheng A1 Wu, Xing YR 2022 SN 1946-1550 K1 Performance evaluation K1 Degradation K1 Transmission electron microscopy K1 Integrated circuit interconnections K1 Failure analysis K1 Tungsten K1 FinFETs K1 fin field-effect transistors K1 interconnection K1 diffusion K1 defects accumulation K1 transmission electron microscopy K1 device reliability SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/IPFA55383.2022.9915773 DO https://doi.org/10.1109/IPFA55383.2022.9915773 SF ELIB - SuUB Bremen
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