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1 Ergebnisse
1
Failure Analysis for SIP IC EOS fail:
, In:
2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
,
Cui, Bardon
;
You, Qiquan
- p. 1-4 , 2022
Link:
https://doi.org/10.1109/IPFA55383.2022.9915777
RT T1
2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
: T1
Failure Analysis for SIP IC EOS fail
UL https://suche.suub.uni-bremen.de/peid=ieee-9915777&Exemplar=1&LAN=DE A1 Cui, Bardon A1 You, Qiquan YR 2022 SN 1946-1550 K1 Integrated circuits K1 Silver K1 System-in-package K1 Welding K1 Earth Observing System K1 Failure analysis K1 Filling K1 SIP IC K1 EOS K1 3D X-ray K1 insufficient filling of silver paste K1 heat dissipation SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/IPFA55383.2022.9915777 DO https://doi.org/10.1109/IPFA55383.2022.9915777 SF ELIB - SuUB Bremen
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