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1 Ergebnisse
1
Cs+ Reactive Sputter Depth Profile for Ultrathin Metal/Meta..:
, In:
2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
,
Teo, Han Wei
;
Wang, Yun
;
Ong, Kenny
.. - p. 1-4 , 2022
Link:
https://doi.org/10.1109/IPFA55383.2022.9915779
RT T1
2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
: T1
Cs+ Reactive Sputter Depth Profile for Ultrathin Metal/Metal-Oxide Composite Film Stack
UL https://suche.suub.uni-bremen.de/peid=ieee-9915779&Exemplar=1&LAN=DE A1 Teo, Han Wei A1 Wang, Yun A1 Ong, Kenny A1 Nistala, Ramesh Rao A1 Mo, Zhiqiang YR 2022 SN 1946-1550 K1 Integrated circuits K1 Industries K1 Failure analysis K1 Semiconductor device manufacture K1 Ions K1 Mass spectroscopy K1 Yield estimation SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/IPFA55383.2022.9915779 DO https://doi.org/10.1109/IPFA55383.2022.9915779 SF ELIB - SuUB Bremen
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