I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
A novel method combining laser ablation and chemical etch t..:
, In:
2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
,
Ting, Siong Luong
;
Tan, Pik Kee
;
SeungJe, Moon
... - p. 1-6 , 2022
Link:
https://doi.org/10.1109/IPFA55383.2022.9915784
RT T1 <cTitle>2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)</cTitle>: T1 <Title>A novel method combining laser ablation and chemical etch to expose packaged silicon backside for electrical fault isolation</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9915784&Exemplar=1&LAN=DE A1 Ting, Siong Luong A1 Tan, Pik Kee A1 SeungJe, Moon A1 Alag, Jerome Cuevas A1 Pan, Yanlin A1 Hnin, Hnin A1 Yu, Tin Tin A1 Kang, Kevin A1 Quah, Alfred A1 Chen, Changqing YR 2022 SN 1946-1550 K1 Technological innovation K1 Sockets K1 Failure analysis K1 Process control K1 Silicon K1 Chemical lasers K1 Laser ablation K1 Sample Preparation K1 Laser Ablation K1 Wet Etch K1 Package Partial Decapsulation K1 Failure Analysis SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/IPFA55383.2022.9915784 DO https://doi.org/10.1109/IPFA55383.2022.9915784 SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)
