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1 Ergebnisse
1
A novel method combining laser ablation and chemical etch t..:
, In:
2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
,
Ting, Siong Luong
;
Tan, Pik Kee
;
SeungJe, Moon
... - p. 1-6 , 2022
Link:
https://doi.org/10.1109/IPFA55383.2022.9915784
RT T1
2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
: T1
A novel method combining laser ablation and chemical etch to expose packaged silicon backside for electrical fault isolation
UL https://suche.suub.uni-bremen.de/peid=ieee-9915784&Exemplar=1&LAN=DE A1 Ting, Siong Luong A1 Tan, Pik Kee A1 SeungJe, Moon A1 Alag, Jerome Cuevas A1 Pan, Yanlin A1 Hnin, Hnin A1 Yu, Tin Tin A1 Kang, Kevin A1 Quah, Alfred A1 Chen, Changqing YR 2022 SN 1946-1550 K1 Technological innovation K1 Sockets K1 Failure analysis K1 Process control K1 Silicon K1 Chemical lasers K1 Laser ablation K1 Sample Preparation K1 Laser Ablation K1 Wet Etch K1 Package Partial Decapsulation K1 Failure Analysis SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/IPFA55383.2022.9915784 DO https://doi.org/10.1109/IPFA55383.2022.9915784 SF ELIB - SuUB Bremen
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