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1 Ergebnisse
1
Technology for the Heterointegration of InP DHBT Chiplets o..:
, In:
2022 52nd European Microwave Conference (EuMC)
,
Rausch, Marko
;
Flisgen, Thomas
;
Stolmacker, Christoph
... - p. 28-31 , 2022
Link:
https://doi.org/10.23919/EuMC54642.2022.9924451
RT T1
2022 52nd European Microwave Conference (EuMC)
: T1
Technology for the Heterointegration of InP DHBT Chiplets on a SiGe BiCMOS Chip for mm-wave MMICs
UL https://suche.suub.uni-bremen.de/peid=ieee-9924451&Exemplar=1&LAN=DE A1 Rausch, Marko A1 Flisgen, Thomas A1 Stolmacker, Christoph A1 Stranz, Andrej A1 Thies, Andreas A1 Doerner, Ralf A1 Yacoub, Hady A1 Heinrich, Wolfgang YR 2022 K1 Performance evaluation K1 Radio frequency K1 Thermal resistance K1 BiCMOS integrated circuits K1 Thermal management K1 Silicon K1 III-V semiconductor materials K1 Flip-chip devices K1 heterobipolar transistor K1 indium phosphide (InP) K1 millimeter-wave (mm-wave) integrated circuits K1 semiconductor device packaging SP 28 OP 31 LK http://dx.doi.org/https://doi.org/10.23919/EuMC54642.2022.9924451 DO https://doi.org/10.23919/EuMC54642.2022.9924451 SF ELIB - SuUB Bremen
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