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Potentials of a SiC Fan-out Wafer Level Package for High Po..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
Mackowiak, Piotr ; Wittler, Olaf ; Braun, Tanja... - p. 45-48 , 2022
Link: https://doi.org/10.1109/ESTC55720.2022.9939379