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1 Ergebnisse
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Printing of Micrometer-Size Features on Complex Substrates ..:
, In:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
,
Wiatrowska, Aneta
;
Fiaczyk, Karolina
;
Kowalczewski, Piotr
... - p. 273-276 , 2022
Link:
https://doi.org/10.1109/ESTC55720.2022.9939386
RT T1
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
: T1
Printing of Micrometer-Size Features on Complex Substrates for System Integration
UL https://suche.suub.uni-bremen.de/peid=ieee-9939386&Exemplar=1&LAN=DE A1 Wiatrowska, Aneta A1 Fiaczyk, Karolina A1 Kowalczewski, Piotr A1 Lysien, Mateusz A1 Witczak, Lukasz A1 Gadzalinska, Jolanta A1 Gradzka-Kurzaj, Iwona A1 Schneider, Ludovic A1 Kosior, Lukasz A1 Granek, Filip YR 2022 K1 Printing K1 Viscosity K1 Silver K1 Shape K1 System integration K1 Ink K1 Conductivity K1 deposition of nanomaterials K1 packaging K1 filling microwells K1 interconnections K1 ultraprecise deposition SP 273 OP 276 LK http://dx.doi.org/https://doi.org/10.1109/ESTC55720.2022.9939386 DO https://doi.org/10.1109/ESTC55720.2022.9939386 SF ELIB - SuUB Bremen
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