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1 Ergebnisse
1
Low Temperature Sapphire to Silicon Flip Chip Interconnects..:
, In:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
,
Ji, Xinrui
;
Van Zeijl, Henk
;
Romijn, Joost
... - p. 368-372 , 2022
Link:
https://doi.org/10.1109/ESTC55720.2022.9939417
RT T1 <cTitle>2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)</cTitle>: T1 <Title>Low Temperature Sapphire to Silicon Flip Chip Interconnects by Copper Nanoparticle Sintering</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9939417&Exemplar=1&LAN=DE A1 Ji, Xinrui A1 Van Zeijl, Henk A1 Romijn, Joost A1 Van Ginkel, Hendrik Joost A1 Liu, Xu A1 Zhang, Guoqi YR 2022 K1 Nanoparticles K1 Thermal expansion K1 Temperature K1 Three-dimensional displays K1 Sintering K1 Resists K1 Silicon K1 flip chip K1 heterogeneous integration K1 copper nanoparticle K1 nano Cu bump K1 low temperature sintering SP 368 OP 372 LK http://dx.doi.org/https://doi.org/10.1109/ESTC55720.2022.9939417 DO https://doi.org/10.1109/ESTC55720.2022.9939417 SF ELIB - SuUB Bremen
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