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1 Ergebnisse
1
Epoxy based Solder Paste for Flexible Substrate with Laser ..:
, In:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
,
Jang, Ki-Seok
;
Eom, Yong-Sung
;
Choi, Gwang-Mun
... - p. 28-30 , 2022
Link:
https://doi.org/10.1109/ESTC55720.2022.9939437
RT T1
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
: T1
Epoxy based Solder Paste for Flexible Substrate with Laser Assisted Bonding Process
UL https://suche.suub.uni-bremen.de/peid=ieee-9939437&Exemplar=1&LAN=DE A1 Jang, Ki-Seok A1 Eom, Yong-Sung A1 Choi, Gwang-Mun A1 Kim, Kook-Man A1 Lee, Jeong-Soo A1 Choi, Kwang-Seong YR 2022 K1 Polyethylene K1 Power lasers K1 Process control K1 Packaging K1 Chemical lasers K1 Temperature control K1 Flip-chip devices K1 epoxy based solder paste K1 hybrid underfill K1 PET K1 laser assisted bonding K1 high elongation solder SP 28 OP 30 LK http://dx.doi.org/https://doi.org/10.1109/ESTC55720.2022.9939437 DO https://doi.org/10.1109/ESTC55720.2022.9939437 SF ELIB - SuUB Bremen
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