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Au-(In-Bi) and Ag-(In-Bi) Metallic Bonding for Temperature ..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
Nguyen, Hoang-Vu ; Kuziora, Stephane Leonard ; Aasmundtveit, Knut E. - p. 373-378 , 2022
Link: https://doi.org/10.1109/ESTC55720.2022.9939439