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1 Ergebnisse
1
Packaging Platform for low to medium Power Packages:
, In:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
,
Thomas, Tina
;
Nguyen, Thanh Duy
;
Blechert, Martin
... - p. 39-44 , 2022
Link:
https://doi.org/10.1109/ESTC55720.2022.9939443
RT T1 <cTitle>2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)</cTitle>: T1 <Title>Packaging Platform for low to medium Power Packages</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9939443&Exemplar=1&LAN=DE A1 Thomas, Tina A1 Nguyen, Thanh Duy A1 Blechert, Martin A1 Hoffmann, Stefan A1 Obst, Mattis A1 Becker, Karl-Friedrich A1 Braun, Tanja A1 Dreissigacker, Marc A1 Schneider-Ramelow, Martin YR 2022 K1 Encapsulation K1 Market research K1 Electronic packaging thermal management K1 Dielectrics K1 Heat transfer K1 Compression molding K1 power packaging K1 compression molding K1 molding compound K1 thermal and dielectrics SP 39 OP 44 LK http://dx.doi.org/https://doi.org/10.1109/ESTC55720.2022.9939443 DO https://doi.org/10.1109/ESTC55720.2022.9939443 SF ELIB - SuUB Bremen
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