I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
High-Resolution Printing of Redistribution Layers for Fan-O..:
, In:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
,
Roshanghias, Ali
;
Dreissigacker, Marc
;
Gradzka-Kurzaj, Iwona
... - p. 254-258 , 2022
Link:
https://doi.org/10.1109/ESTC55720.2022.9939451
RT T1 <cTitle>2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)</cTitle>: T1 <Title>High-Resolution Printing of Redistribution Layers for Fan-Out Wafer-Level Packaging by using Ultra-Precise Micro-deposition Technology</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9939451&Exemplar=1&LAN=DE A1 Roshanghias, Ali A1 Dreissigacker, Marc A1 Gradzka-Kurzaj, Iwona A1 Binder, Alfred A1 Ramelow, Martin Schneider A1 Witczak, Lukasz A1 Braun, Tanja YR 2022 K1 Micromechanical devices K1 Radio frequency K1 Silver K1 Three-dimensional displays K1 Program processors K1 Polyimides K1 Surfaces K1 Redistribution layers K1 Fan-out wafer-level packaging K1 additive manufacturing K1 UPD K1 Inkjet printing K1 extrusion printing K1 Interconnects SP 254 OP 258 LK http://dx.doi.org/https://doi.org/10.1109/ESTC55720.2022.9939451 DO https://doi.org/10.1109/ESTC55720.2022.9939451 SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)
