I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
Predicting thermal resistance of solder joints based on Sca..:
, In:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
,
Zippelius, Andreas
;
Strobl, Tobias
;
Schmid, Maximilian
... - p. 566-575 , 2022
Link:
https://doi.org/10.1109/ESTC55720.2022.9939465
RT T1 <cTitle>2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)</cTitle>: T1 <Title>Predicting thermal resistance of solder joints based on Scanning Acoustic Microscopy using Artificial Neural Networks</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9939465&Exemplar=1&LAN=DE A1 Zippelius, Andreas A1 Strobl, Tobias A1 Schmid, Maximilian A1 Hermann, Joseph A1 Hoffmann, Alwin A1 Elger, Gordon YR 2022 K1 Scanning electron microscopy K1 Microscopy K1 Thermal resistance K1 Aging K1 Light emitting diodes K1 Acoustic measurements K1 Acoustics K1 Solder Joints K1 LED K1 non-destructive testing K1 Machine Learning K1 Scanning Acoustic Microscopy (SAM) K1 Transient Thermal Analysis (TTA) K1 Convolutional Neural Network (CNN) SP 566 OP 575 LK http://dx.doi.org/https://doi.org/10.1109/ESTC55720.2022.9939465 DO https://doi.org/10.1109/ESTC55720.2022.9939465 SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)
