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1 Ergebnisse
1
Selective Deposition of Conductive Particles for Anisotropi..:
, In:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
,
Huynh, Van Long
;
Aasmundtveit, Knut Eilif
;
Nguyen, Hoang-Vu
- p. 124-128 , 2022
Link:
https://doi.org/10.1109/ESTC55720.2022.9939469
RT T1
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
: T1
Selective Deposition of Conductive Particles for Anisotropic Conductive Adhesive Interconnects
UL https://suche.suub.uni-bremen.de/peid=ieee-9939469&Exemplar=1&LAN=DE A1 Huynh, Van Long A1 Aasmundtveit, Knut Eilif A1 Nguyen, Hoang-Vu YR 2022 K1 Resistance K1 Contacts K1 Conductivity measurement K1 Particle measurements K1 Bonding forces K1 Silicon K1 Electrical resistance measurement K1 Anisotropic conductive adhesive K1 ACA K1 capillary assembly K1 particle deposition SP 124 OP 128 LK http://dx.doi.org/https://doi.org/10.1109/ESTC55720.2022.9939469 DO https://doi.org/10.1109/ESTC55720.2022.9939469 SF ELIB - SuUB Bremen
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