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1 Ergebnisse
1
Development of a Flexure Mechanism for Thin Die Pick-up Pro..:
, In:
2022 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO)
,
Wei, Huaxian
;
Wu, Tao
;
Wu, Fupei
.. - p. 196-199 , 2022
Link:
https://doi.org/10.1109/3M-NANO56083.2022.9941620
RT T1
2022 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO)
: T1
Development of a Flexure Mechanism for Thin Die Pick-up Process
UL https://suche.suub.uni-bremen.de/peid=ieee-9941620&Exemplar=1&LAN=DE A1 Wei, Huaxian A1 Wu, Tao A1 Wu, Fupei A1 Li, Yuanchao A1 Niu, Xiaodong YR 2022 SN 2694-510X K1 Bridges K1 Actuators K1 Prototypes K1 Process control K1 Packaging K1 Pins K1 Response surface methodology K1 nano-positioning K1 flexure mechanism K1 thin die K1 pick-up process SP 196 OP 199 LK http://dx.doi.org/https://doi.org/10.1109/3M-NANO56083.2022.9941620 DO https://doi.org/10.1109/3M-NANO56083.2022.9941620 SF ELIB - SuUB Bremen
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